Kerafol
Im Bereich Wärmemanagement bietet der Folienherstellungsspezialist KERAFOL - Keramische Folien GmbH & Co. KG eine große Auswahl an Wärmeleitfolien und Vergussmaterialien.
Mehr zu Kerafol1,5 W/mK // 8,0kV dielectric breakdown voltage // Viscosity 140-180Pas
- Room temperature curing
- Liquid assembly
- silicone free
- Contains no diisocyanate
1,8 W/mK // 10kV dielectric breakdown voltage // Viscosity 45-70Pas
- Room temperature curing
- Easy to process and dispense
- High material utilization
- Very soft and elastic
1,8 W/mK // 7,5kV dielectric breakdown voltage // Viscosity 2-8Pas
- Room temperature curing
- Higher thermal conductivity in comparison to potting material
- Usage for Encapsulation, electromagnetic coils and applications with small abrication tolerances
- Low Viscosity Gap Filler Liquid
1,5 W/mK // 5,0kV dielectric breakdownvoltage // 30-45 Shore 00
- High thermal conductivity
- High EMI suppression
- @frequencies up to 77 GHz
- Electromagnetic properties independent from layer thickness
Delta T ≤ 1,2°C // isolation (53 pS/m) // silicon free
- Outstanding thermal performance
- Easy to apply
- Available in different packaging forms (syringe, cartridges, cans & hobbocks)
- Available as silicone and silicone free option
- Very low bond line thickness
1,3 W/mK // 2,0 kV dielectric breakdown voltage // 0,18 - 0,3mm
- High thermal conductivity
- High adhesive strength
- Good adhesion to various surfaces
- Low thickness
6,0 W/mK // 4,0kV dielectric breakdown voltage // 0,1 - 0,3mm // with adhesive coating
- Silicone free (polyurethane)
- Very high thermal performance
- Good ratio between thermal performance and electrical isolation
- Softening effect for an additional increase in heat output
3,0 W/mK // 6,0kV dielectric breakdown voltage // 0,2mm
- Silicone free (Epoxy)
- High temperature stability
- Good ratio between thermal performance and electrical isolation
- Non sticky, available with adhesive coating
1,5 W/mK // 6,0kV dielectric breakdown voltage // Viscosity 20-40Pas
- High bond strength
- Room temperature curing
- Thixothropic and filling surface structures
- Very soft to compensate mechanical impacts like vibrations
1,5 W/mK // 5,0kV dielectric breakdown voltage // 30-45 Shore 00
- Low cost solution
- Very low hardness
- Elastic behavior
- Also available as a double layer material
2,5 W/mK // 5,0kV dielectric breakdown voltage // 1,0 - 5,0 mm
- Good compromise between softness and thermal conductivity
- Very soft to compensate mechanical impacts like vibrations
- Elastic behavior
3,5 W/mK // 5,0kV dielectric breakdown voltage // 1,0 - 4,0 mm
- Low thermal resistance
- Good price performance ratio
- Elastic behavior
2,5 W/mK // 3,5kV dielectric breakdownvoltage // 0,225mm
- Smooth surface
- Very good thermal properties even at low contact pressure
- Low hardness
- High self-adhesion
- High temperature stability
6,5 W/mK // 1,0kV dielectric breakdownvoltage // 0,25 - 0,3 mm
- High thermal conductivity
- High electrical insulating
- Available with adhesive coating
7,5 W/mK // non isolating, 0,15 - 0,29mm
Outstanding thermal performance
- Heat spreading effect, perfect match for “Hot Spots”
- Electrically conductive
- Non sticky, available with adhesive coating
- High temperature stability
Im Bereich Wärmemanagement bietet der Folienherstellungsspezialist KERAFOL - Keramische Folien GmbH & Co. KG eine große Auswahl an Wärmeleitfolien und Vergussmaterialien.
Mehr zu KerafolDie Ursache eines jeden thermischen Managements: Die Arrhenius-Gleichung - 10°C Temperaturerhöhung halbiert die Lebensdauer. Allem technischen Fortschritt zum Trotz bleiben die physikalischen und chemischen Zusammenhänge der Arrhenius-Gleichung bestehen. Die beschleunigte Alterung von Bauelementen in Abhängigkeit der Temperatur fordert im Entwicklungsprozess mehr denn je ein effizientes thermisches Management.
Mehr zum Bereich Wärmemanagement