With advances in science and technology, various industries in which tantalum capacitors are used are constantly evolving. These mainly include automotive electronics, consumer electronics, civil explosives, servers, data centers, SSDs, and AI.
Products with a traditional structure equipped with lead frames were unable to meet customer development requirements due to their disadvantages, such as large size, low reliability, high leakage current, and high ESR performance.
To meet the new requirements of various industries and customers for miniaturization, reduced thickness, high reliability, and high performance, Sunlord has developed new products without lead frames to reduce size and improve electrical performance: the TP series polymer tantalum capacitors and TM series MnO2tantalum capacitors.
Background
Consumer electronic products such as smartphones, tablets, and wearables are becoming smaller and thinner. While maintaining their original capacity and voltage, conventional tantalum capacitors cannot reduce product thickness to meet these requirements.
In addition, the precision requirements for electronic ignition module controllers are becoming increasingly stringent. Conventional tantalum capacitors exhibit two primary deficiencies: leakage current and short shutdown time, which means they cannot meet customer requirements for high-end products.
Tantalum capacitors are also widely used in servers. As the operating frequency and power of server power supplies increase, the ripple current in the circuit also does. Conventional tantalum capacitors have a high ESR value, which results in insufficient ripple resistance and can easily lead to thermal failure of the product.
Against this background, Sunlord's new tantalum capacitor with electrode structure has been optimized in terms of material, structure, and process, and its size and electrical performance have been significantly improved compared to the conventional tantalum capacitor.
Features
- Ultra-thin and high volume efficiency
- Low ESR value: Good resistance to ripple current
- Low leakage current and low self-heating
- Self-healing capability and high reliability of polymer tantalum capacitors
Applications
- Servers, SSDs, etc.
- Electronic igniters
- Laptops, tablets
- Robots, medical devices, UAV
Shape and dimensions
TM series MnO₂ tantalum capacitors
Standard housing dimensions:
| Case Code | EIA | L | W | H | F | S |
|---|---|---|---|---|---|---|
| A16 | 3216-18 | 3.20±0.20 [.0126±.008] | 1.60±0.20 [.063±.008] | 1.60±0.20 [.063±.008] | 1.20±0.10 [.047±.004] | 0.80±0.30 [.031±.012] |
| B20 | 3528-21 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 2.00±0.10 [.079±.004] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| C25 | 6032-28 | 6.00±0.30 [.236±.012] | 3.20±0.30 [.126±.012] | 2.50±0.30 [.098±.012] | 2.20±0.10 [.087±.004] | 1.30±0.30 [.051±.012] |
| D28 | 7343-31 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 2.80±0.30 [.11±.012] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
| D40 | 7343-43 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 4.00±0.30 [.157±.012] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
Dimensions of flat housing:
| Case Code | EIA | L | W | H max. | F | S |
|---|---|---|---|---|---|---|
| A12 | 3216-12 | 3.20±0.20 [.126±.008] | 1.60±0.20 [.063±.008] | 1.20 [.047] | 1.20±0.10 [.047±.004] | 0.80±0.30 [.031±.012] |
| B12 | 3528-12 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 1.20 [.047] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| B15 | 3528-15 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 1.50 [.059] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| C20 | 6032-20 | 6.00±0.30 [.236±.012] | 3.20±0.30 [.126±.012] | 2.00 [.079] | 2.20±0.10 [.087±.004] | 1.30±0.30 [.051±.012] |
| D20 | 7343-20 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 2.00 [.079] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
TP Series Polymer Tantalum Capacitors
Standard case dimensions:
| Case Code | EIA | L | W | H | F | S |
|---|---|---|---|---|---|---|
| B20 | 3528-21 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 2.00±0.10 [.079±.004] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| C25 | 6032-28 | 6.00±0.30 [.236±.012] | 3.20±0.30 [.126±.012] | 2.50±0.30 [.098±.012] | 2.20±0.10 [.087±.004] | 1.30±0.30 [.051±.012] |
| D28 | 7343-31 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 2.80±0.30 [.11±.012] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
| D40 | 7343-43 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 4.00±0.30 [.157±.012] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
Low Profile dimensions:
| Case Code | EIA | L | W | H max. | F | S |
|---|---|---|---|---|---|---|
| B12 | 3528-12 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 1.20 [.047] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| B15 | 3528-15 | 3.50±0.20 [.138±.008] | 2.80±0.20 [.11±.008] | 1.50 [.059] | 2.20±0.10 [.087±.004] | 0.90±0.30 [.035±.012] |
| C20 | 6032-20 | 6.00±0.30 [.236±.012] | 3.20±0.30 [.126±.012] | 2.00 [.079] | 2.20±0.10 [.087±.004] | 1.30±0.30 [.051±.012] |
| D15 | 7343-15 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 1.50 [.059] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
| D20 | 7343-20 | 7.30±0.30 [.287±.012] | 4.30±0.30 [.169±.012] | 2.00 [.079] | 2.40±0.10 [.094±.004] | 1.30±0.30 [.051±.012] |
Product advantages
- High volume efficiency, small size, and ultra-thin
The volume utilization rate of conventional tantalum capacitors is 25% lower than that of products with a new electrode structure due to the large surface area of the plastic packaging and the bending structure of the conductor frame outside the tantalum core, allowing tantalum capacitors with a new electrode structure to be miniaturized and made thinner.
- High voltage resistance and large capacity
With the same housing volume, the T-Cap with its new structure can increase the length of the tantalum pellet and the amount of tantalum powder filling.
According to the formula CV = specific volume * powder weight, an increase in powder weight corresponds to an increase in the CV value at a constant specific volume. Therefore, the C value and/or the V value can be increased to achieve a higher voltage and a larger capacity.
- Low leakage current
1. The new T-caps with the new design are manufactured using a low-pressure compression molding process, which reduces damage to the Ta2O5 dielectric layer and the cathode foil and prevents deterioration of the LC.
Comparison of LC values of new and conventional products (25 V, 33 μF, size C):
After molding, the LC value of the conventional T-Cap structure changes from 2.67 μA to 5.45 μA, an increase of 104%. However, the LC value of the new T-Cap structure changes from 2.57 μA to 3.72 μA, an increase of only 45%.
2. The products with the structure use the lower electrode of the printed circuit board—without bending it.
Production
Sunlord's new TP and TM series are already in mass production.
Do you have any questions or need initial samples?
Contact us today with your project!
Stay up to date!
Sign up for our newsletter and never miss any news: