Thermally Conductive Adhesives: Reliable Heat Dissipation for Electronics

The increasing miniaturization and simultaneous performance enhancement of electronic components present growing challenges in thermal management for developers, engineers, and purchasers. Higher component densities and greater power inevitably lead to increased heat generation. 

Without effective countermeasures, this heat can critically raise component temperatures, shorten lifespan, and in the worst case, cause total failure of the component or assembly. 

To ensure reliable cooling, it is essential to efficiently transfer the generated heat from the source, such as a semiconductor, to the sink, like a heat sink. This is where Thermal Interface Materials (TIMs) become relevant, materials that are both thermally conductive and electrically insulating. In partnership with KERAFOL®, a leading specialist in this field, alfatec offers high-quality solutions with the KERATHERM® and KERAMOLD® product lines. 

Thermally conductive adhesives play a central role here. 

 

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What Are Thermally Conductive Adhesives and Why Are They Critical?

Thermally conductive adhesives—often referred to as thermal adhesives—are specialized bonding agents that combine two essential functions: 

  • Efficient thermal conduction: They bridge microscopic air gaps between components and heat sinks, optimizing thermal transfer to reduce the operating temperature of electronic components. 
  • Strong adhesive strength: They provide permanent and reliable bonding of components to heat sinks or other surfaces. 

alfatec focuses on proven 2-component silicone-based thermal adhesives from KERAFOL®. These systems cure at room temperature and offer excellent adhesion. The key advantage: additional mechanical fastening with screws or clamps is often unnecessary. This not only saves space and weight but also simplifies the assembly process and reduces costs. 

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Processing and Application – Flexible and Efficient

KERAFOL® thermal adhesives from alfatec are tailored to various production requirements: 

  • Packaging sizes: Available in practical dual cartridges (e.g., 400 ml) for manual or semi-automated processing, and in large containers (up to 34.5 kg) for integration into automated production lines. 
  • Application methods: In addition to manual dispensing with applicator guns, the liquid 2-component adhesives are ideal for use with automated dispensing systems. This ensures precise dosing, high repeatability, and fast cycle times in series production. 
Benefits and Special Features at a Glance
Combined function: Thermal conduction and mechanical bonding in one product.
Simplified assembly: Potential elimination of screws, clamps, and additional mounting hardware.
Weight and space savings: More compact designs by omitting mechanical fasteners.
Electrical insulation: Reliable protection against leakage currents and short circuits.
Stress compensation: Absorbs vibration and thermomechanical stress.
Tolerance compensation: Fills gaps and offsets surface irregularities.
Process reliability: Defined curing at room temperature or accelerated with heat.
Automation-ready: Suitable for efficient, automated dispensing processes.
Application Areas
Bonding power semiconductors such as MOSFETs and IGBTs to heat sinks
Fixing LEDs to PCBs or heat sinks
Thermal coupling of sensors
Mounting components in power supplies
Automotive electronics applications
General power electronics bonding
Fixing processors or FPGAs to heat spreaders where soldering is not possible or desired

Technical Excellence: Parameters of KERAFOL® Thermal Adhesives

The performance of a thermal adhesive is defined by specific technical parameters. Below is an example of typical values for a KERAFOL® 2K silicone adhesive (Type 100 RT)

 

Property Unit Example Value (100 RT) Description 
Color -BrownVisual identifier 
Mixing ratio -1 : 1Easy and reliable mixing 
Curing °C / Time20 min @ RTFast room temperature curing 
Thermal conductivity λW/mK1.5Heat transfer capability 
Thermal resistance Rth K/W1.66Resistance to heat flow 
Hardness  Shore A 20 - 35Softness for stress compensation 
Shear strengthMPa> 15High mechanical bond strength 
Dielectric strength Ud AC kV6.0High electrical insulation 
Density g/cm³2.1Material density 
Viscosity (mixed) Pas40 - 70Flow behavior before curing 
Operating temperature°C-40 - +180Wide application range 

Note: These are example values. Exact data may vary by product type. Refer to the respective datasheets for detailed specifications. 

Product series list
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Thermally conductive adhesive

Here you can access our series in the area of heat-conducting adhesives.

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Our partner in the field of thermally conductive adhesives

Kerafol

Our partner KERAFOL offers a wide range of thermally conductive films and potting materials, which are used in microelectronics and sensor technology, among other things. The company develops and produces in Germany and, in addition to established standard products, also offers customised solutions, which can optionally be implemented silicone-free and after an automatic punching process.

 

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Your Partner for Thermal Management: alfatec & KERAFOL®

Rely on the expertise of alfatec as a distributor of electronic components and the innovation of KERAFOL® in thermal management. We offer not only high-quality products but also technical consulting tailored to your specific application. 

Request your personalized quote now

See for yourself the quality and performance of our thermal conductive adhesives. Request a non-binding quote today or download the data sheets.

alfatec – your partner for high-quality electronic components

As your expert partner for electronic components, alfatec supports you in selecting the right thermal conductive adhesives for your applications. We offer comprehensive advice and are happy to answer any questions you may have about power modules.

Do you have questions about our thermal conductive adhesives or would you like a personal consultation? Feel free to contact us.