Thermally conductive adhesive
Here you can access our series in the area of heat-conducting adhesives.
Discover nowThe increasing miniaturization and simultaneous performance enhancement of electronic components present growing challenges in thermal management for developers, engineers, and purchasers. Higher component densities and greater power inevitably lead to increased heat generation.
Without effective countermeasures, this heat can critically raise component temperatures, shorten lifespan, and in the worst case, cause total failure of the component or assembly.
To ensure reliable cooling, it is essential to efficiently transfer the generated heat from the source, such as a semiconductor, to the sink, like a heat sink. This is where Thermal Interface Materials (TIMs) become relevant, materials that are both thermally conductive and electrically insulating. In partnership with KERAFOL®, a leading specialist in this field, alfatec offers high-quality solutions with the KERATHERM® and KERAMOLD® product lines.
Thermally conductive adhesives play a central role here.
Thermally conductive adhesives—often referred to as thermal adhesives—are specialized bonding agents that combine two essential functions:
alfatec focuses on proven 2-component silicone-based thermal adhesives from KERAFOL®. These systems cure at room temperature and offer excellent adhesion. The key advantage: additional mechanical fastening with screws or clamps is often unnecessary. This not only saves space and weight but also simplifies the assembly process and reduces costs.
Click here to go directly to our selection and data sheets for product series in the thermally conductive adhesives section.
To the series searchKERAFOL® thermal adhesives from alfatec are tailored to various production requirements:
The performance of a thermal adhesive is defined by specific technical parameters. Below is an example of typical values for a KERAFOL® 2K silicone adhesive (Type 100 RT):
| Property | Unit | Example Value (100 RT) | Description |
|---|---|---|---|
| Color | - | Brown | Visual identifier |
| Mixing ratio | - | 1 : 1 | Easy and reliable mixing |
| Curing | °C / Time | 20 min @ RT | Fast room temperature curing |
| Thermal conductivity λ | W/mK | 1.5 | Heat transfer capability |
| Thermal resistance Rth | K/W | 1.66 | Resistance to heat flow |
| Hardness | Shore A | 20 - 35 | Softness for stress compensation |
| Shear strength | MPa | > 15 | High mechanical bond strength |
| Dielectric strength Ud AC | kV | 6.0 | High electrical insulation |
| Density | g/cm³ | 2.1 | Material density |
| Viscosity (mixed) | Pas | 40 - 70 | Flow behavior before curing |
| Operating temperature | °C | -40 - +180 | Wide application range |
Note: These are example values. Exact data may vary by product type. Refer to the respective datasheets for detailed specifications.
Our partner KERAFOL offers a wide range of thermally conductive films and potting materials, which are used in microelectronics and sensor technology, among other things. The company develops and produces in Germany and, in addition to established standard products, also offers customised solutions, which can optionally be implemented silicone-free and after an automatic punching process.
Rely on the expertise of alfatec as a distributor of electronic components and the innovation of KERAFOL® in thermal management. We offer not only high-quality products but also technical consulting tailored to your specific application.
See for yourself the quality and performance of our thermal conductive adhesives. Request a non-binding quote today or download the data sheets.
alfatec – your partner for high-quality electronic components
As your expert partner for electronic components, alfatec supports you in selecting the right thermal conductive adhesives for your applications. We offer comprehensive advice and are happy to answer any questions you may have about power modules.
Do you have questions about our thermal conductive adhesives or would you like a personal consultation? Feel free to contact us.